Figure 1 | NPG Asia Materials

Figure 1

From: LEGO-like assembly of peelable, deformable components for integrated devices

Figure 1

Processing steps for the fabrication of peelable devices and LEGO-like assembly of electronic circuits. (a) Electrochemical capacitors fabricated on a wafer encapsulated in a polymer electrolyte layer. (b) The process of peeling off the capacitors. (c) Flexible, peelable electrochemical capacitors. (d) LEGO-like assembly. The arrows indicate the direction of integration. (e) A simple RLC circuit using these methodologies.

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