Figure 1
From: 3D-printed microelectronics for integrated circuitry and passive wireless sensors
Schematic diagram of the additive 3D manufacturing process including the filling of liquid metal paste for producing basic microelectronic components, integrated circuitries, and a passive wireless sensor. (a) The 3D fabrication process with embedded and electrically conductive structures. (b) 3D microelectronics components, including parallel-plate capacitors, solenoid-type inductors, and meandering-shape resistors. (c) A 3D LC tank, which is formed by combining a solenoid-type inductor and a parallel-plate capacitor. (d) A wireless passive sensor demonstration of a “smart cap,” containing the 3D-printed LC-resonant circuit. The degradation of the liquid food inside the liquid package can cause the changes of the dielectric constant and the shift of the resonance frequency of the LC circuity. A wireless inductive reader is used to monitor the signals in real time.
