Figure 2
From: 3D-printed microelectronics for integrated circuitry and passive wireless sensors
(a) An optical image showing fabricated microelectronics components produced using the 3D printing process without the embedded conductive structure compared with a one-cent US coin. (b) Fabricated 3D components, including resistors, inductors, and capacitors, and an LC tank after the liquid metal paste filling and curing process. (c) The cross-sectional view of a 4-turn solenoid coil. The overall size of the prototype resistor, inductor, and capacitor are 10 × 10 × 2.4, 10 × 10 × 6.4, and 10 × 10 × 6.4 mm3, respectively, whereas the size of the LC tank is 10 × 20 × 6.4 mm3.
