Figure 4 | Microsystems & Nanoengineering

Figure 4

From: High-aspect-ratio nanoimprint process chains

Figure 4

Schematic representation of the three applied replication processes: (a) T-NIL, in which a hard stamp is used to press a heated thermoplastic polymer film and fill the cavities of the stamp by squeeze flow and capillary forces. (b) UV-NIL, in which a transparent stamp is placed upon a liquid prepolymer layer to fill the cavities by capillary action, and subsequent UV light exposure is used to crosslink the polymer. (c) In micromoulding into capillaries (MIMIC) a transparent stamp with an open, continuous fluidic network is placed on the substrate and filled by capillary action from the side with a liquid prepolymer that is crosslinked by ultraviolet (UV) light exposure.

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