Table 1 Summary of the results obtained using the different moulds and replication techniques
Master | Mould | Process | Replicated materials | Max. AR (h:w) | Resolution at max. AR (nm) | Resolution at max. AR (nm) | Max. resolution/corresponding AR (nm)/(h:w) | Residual layer (μm) |
|---|---|---|---|---|---|---|---|---|
Silicon cryo-etch (negative) | Si (master) | T-NIL | PMMA | 17 | 180 | 180 | 180/17 | ~2 |
Si (master) | UV-NIL | OrmoStamp OrmoComp OrmoClear | 17 | 180 | 180 | 180/17 | >10 | |
Si (master) | UV-MIMIC | OrmoComp | 17 | 180 | 180 | 180/17 | ~1 | |
OrmoComp 2PP DWL (positive) | UV-PDMS, OrmoStamp | UV-NIL | OrmoComp OrmoClear | 28 | 350 | 350 | 200/20 | >10 |
UV-PDMS | UV-MIMIC | OrmoComp | 28 | 350 | 350 | 200/20 | ~0 |
