Figure 2: Wafer, die and chip packaging.
From: An integrated semiconductor device enabling non-optical genome sequencing
a, Fabricated CMOS 8′′ wafer containing approximately 200 individual functional ion sensor die. b, Unpackaged die, after automated dicing of wafer, with functional regions indicated. c, Die in ceramic package wire bonded for electrical connection, shown with moulded fluidic lid to allow addition of sequencing reagents.
