Figure 2: Mechanical and pressure-sensing characterization of EMCP. | Nature Communications

Figure 2: Mechanical and pressure-sensing characterization of EMCP.

From: An ultra-sensitive resistive pressure sensor based on hollow-sphere microstructure induced elasticity in conducting polymer film

Figure 2

(a) Six consecutive compression tests on the EMCP thin film. (b) Resistance response and pressure sensitivity of the EMCP pressure sensor. The error bars represent one standard deviation. (c) Instant response of the EMCP pressure sensor, which exhibits response times of 50 ms (the right figure shows the magnified curve of the left one). (d) First five cycles of the piezoresistance of the device. (e) Resistance of the EMCP pressure sensor over 8,000 cycles. (f) Temperature-dependent resistance response of the device.

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