Abstract
Thickness-controlled residual stress was experimentally measured during drying of polyimide films using interferometer and bending beam systems. The local solvent concentration and temperature inside films were theoretically predicted using Fick’s diffusion and Fourier’s heat transfer equations. Introduction of bending moment theory made it possible to develop equations relating the residual stress with solvent concentration in films. The experimental stress behavior was in good agreement with the theoretical one, and the modulus of polyimide/NMP systems was determined from the best fit of two results.
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Park, K., Kwon, Y. & Kim, D. Theoretical and Experimental Analysis on the Thickness-Controlled Residual Stress during Drying of Solvent-Absorbed Polymer Films. Polym J 33, 503–508 (2001). https://doi.org/10.1295/polymj.33.503
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DOI: https://doi.org/10.1295/polymj.33.503
