Abstract
A novel trifunctional fluorine containing epoxy compound, 1,1,1-Tris(2,3-epoxypropoxyphenyl)-2,2,2-trifluoroethane (TEF) synthesized starting from 4-bromoanisole was cured with alicyclic anhydride or aromatic diamines to produce the epoxy resins. As comparison, commercial available Biphenol A 828 epoxy (BPA) was cured under the same conditions. Experimental results indicated that the cured TEF epoxy resins showed good thermal stability with onset thermal decomposition temperature (Td) of 363–388 °C in nitrogen, glass transition temperature (Tg) of 210–287 °C (determined by DMA) and coefficient of thermal expansion (CTE) ranged in 46.7–59.6 ppm/°C. The fluorine containing epoxy resins possessed outstanding mechanical properties with flexural strengths of 64–115 MPa, flexural moduli of 2.29–2.65 GPa. The epoxy resins also exhibited excellent electric insulating properties with volume resistivity of 1.19–8.15×1016 Ω·cm and the dielectric constants at 1 MHz of 3.2–3.5 as well as low moisture absorption of 0.31–0.87%. As comparison with BPA resins, the trifunctional fluorine containing TEF resins exhibit higher Tg and improved dielectric properties as well as low CTE, which are promising candidates for advanced microelectronic packaging.
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Ge, Z., Tao, Z., Liu, J. et al. Synthesis and Characterization of Novel Trifunctional Fluorine Containing Epoxy Resins Based on 1,1,1-Tris(2,3-epoxypropoxyphenyl)-2,2,2-trifluoroethane. Polym J 39, 1135–1142 (2007). https://doi.org/10.1295/polymj.PJ2007096
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DOI: https://doi.org/10.1295/polymj.PJ2007096
