Fig. 7
From: Micro-light-emitting diodes with quantum dots in display technology
μ-LED monolithic integration techniques. Schematics of a metal wiring, b flip chip bonding, c microtube bonding and d adhesive bonding. Reproduced from a ref. 79 with permission from Elsevier, b ref. 80 with permission from AIP Publishing, c ref. 81 with permission from John Wiley and Sons and d ref. 83 with permission from RSC Publishing
