Fig. 4: Properties of lithography-enabled micro-LEDs and metasurfaces.
From: Augmented reality and virtual reality displays: emerging technologies and future perspectives
a Illustration of flip-chip bonding technology. b Simulated IQE-LED size relations for red and blue LEDs based on ABC model. c Comparison of EQE of different LED sizes with and without KOH and ALD side wall treatment. d Angular emission profiles of LEDs with different sizes. Metasurfaces based on e resonance-tuning, f non-resonance tuning and g combination of both. h Replication master and i replicated SRG based on nanoimprint lithography. Reproduced from a ref. 55 with permission from AIP Publishing, b ref. 61 with permission from PNAS, c ref. 66 with permission from IOP Publishing, d ref. 67 with permission from AIP Publishing, e ref. 69 with permission from OSA Publishing f ref. 48 with permission from AAAS g ref. 70 with permission from AAAS and h, i ref. 85 with permission from OSA Publishing
