Table 4 Material removal of sub-aperture tool on PVD Si-cladding RB-SiC substrate
From: Challenges and strategies in high-accuracy manufacturing of the world’s largest SiC aspheric mirror
Sub-aperture tool | CCOS | Stressed lap | MRF | IBF |
|---|---|---|---|---|
Typical spot |
|
|
|
|
Spot size/mm | ⌀20 | ⌀340 | 47.7 × 24.4 | FWHM 44.5 |
VRR (mm3/min) | 0.105 | 1.51 | 0.39 | 0.71 |
PRR (μm/min) | 0.66 | 0.02 | 0.90 | 0.31 |
Typical Param. #1 | Pad Diam. | Pad Diam. | Wheel Diam. | Grid Diam. |
Value | 15 mm | 300 mm | 400 mm | 50 mm |
Typical Param. #2 | Spindle RPM | Spindle RPM | Wheel RPM | Grid Voltage |
Value | 300 | 50 | 60 | 1003 |
