Fig. 9: Process flow diagram.
From: Using light to image millimeter wave based on stacked meta-MEMS chip
The process flow diagram: a cleaning glass surfaces; b Coating ITO film; c Silicon wafer thinning; d Cutting silicon wafer as support blocks; e Gluing the support block and ITO glass; f Double-sided polishing; g Double-sided SiNx deposition; h Photolithographed and etched; i Coating Au film and lifted off; j ICP etching and Wet etching the silicon substrate; k Stacking the upper and lower chips
