Fig. 1: System architecture of optical interconnects and optical mmWave/THz sensing and communication.
From: A 3.584 Tbps coherent receiver chip on InP-LiNbO3 wafer-level integration platform
DSP digital signal processor, ASIC application-specific integrated circuit, TRx optical transceiver, IMDD intensity modulation and direct detection, PD photodiode, MZM Mach-Zehnder modulator, MWP microwave photonics
