Fig. 4: Micro-heat-dissipator design, fabrication, and testing for the STEG cold-side thermal management | Light: Science & Applications

Fig. 4: Micro-heat-dissipator design, fabrication, and testing for the STEG cold-side thermal management

From: 15-Fold increase in solar thermoelectric generator performance through femtosecond-laser spectral engineering and thermal management

Fig. 4

a 3D surface profiles of the μ-dissipators with different surface geometries. Two types of patterns are created: the line pattern (S1, S2, and S3) and the grid pattern (S4, S5, and S6). For each pattern, three different groove widths of 50 μm, 150 μm, and 300 μm are fabricated, and the groove depth is maintained at ~100 μm. b Heat-dissipation coefficient for μ-dissipators with different surface geometries measured under different temperatures. Simulated c convective cooling power (\({Q}_{c}\)), d radiative cooling power (\({Q}_{R}\)), and e overall cooling capacity enhancements for μ-dissipator with different surface topographies at 100 °C. f Surface profiles of the bare TEG, Al dissipator, and μ-dissipator. The insert is the 3D view of the μ-dissipator. g Absorption spectra of the TEG’s ceramic dissipator, Al dissipator, and μ-dissipator. h STEG peak output power with different cold-side heat dissipators when the hot-side temperature is at 40–100 °C

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