Fig. 1: The fabrication of flexible GMR devices. | Microsystems & Nanoengineering

Fig. 1: The fabrication of flexible GMR devices.

From: An ultrathin, rapidly fabricated, flexible giant magnetoresistive electronic skin

Fig. 1

a Illustration of a typical electrochemical delamination process. b Illustration of a PI-electronic foil preparation on a low-resistance silicon wafer in an NaCl solution. The NaCl solution climbs upward, facilitating the occurrence of reactions. c Schematic diagram of the electrochemical reactions at the cathode and anode. d Photographs showing the progress in the detachment of a 1.6 cm × 1.6 cm GMR sensor. e Average delamination time when applying a voltage ranging from 10 to 20 V; f Average delamination time when the NaCl concentration increases from 0.02 M to 5.43 M (supersaturation)

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