Table 5 Elastic material properties of the FEA model

From: Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration

Material

CTE (ppm/°C)

E (GPa)

v

Cu

16.7

see Table 4

Si

020 °C: 2.6

350 °C: 4.4

130

0.28

SiO2

0.52

71

0.17

Back to article page