Fig. 1: Morphology controls of QD assemblies by deposition method variations. | NPG Asia Materials

Fig. 1: Morphology controls of QD assemblies by deposition method variations.

From: On-demand tuning of charge accumulation and carrier mobility in quantum dot solids for electron transport and energy storage devices

Fig. 1

a Schematic of works in which the morphology of ligand-exchanged colloidal quantum dot (CQD) assemblies can be controlled by varying the deposition methods to produce amorphous-like assemblies, hierarchical porous assemblies, and compact superlattice structures. b Comparison of atomic force microscopy (AFM) images of the first deposited monolayers of 1,2-ethanedithiol (EDT)-treated PbS QDs prepared by spin-coating, c dip-coating, and d liquid/air interfacial assembly. Transmission electron micrographs (TEM) of the QD assemblies made by the three different methods: e spin-coating, f dip-coating, and g liquid/air interfacial assembly. These three different deposition methods result in different assembly morphologies. The high magnification TEM images (inset figures) show the distances between individual QDs, which are in the range of 0.5–0.9nm. These distance values imply attachment of the shorter EDT ligands and removal of the native oleic acid ligand.

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