Fig. 2

The morphology of Li deposition on Cu surface. SEM images of a–d and e–h show the Li deposits in ether-based and MIP-based electrolyte with 2 mAh cm⁻² at 0.5 mA cm⁻², respectively. The inset digital images in a and e show the typical Li deposit distribution after plating without and with tuning Li ion distribution. The SEM images of a, b and e, f show ether-based and MIP-based in plane Li deposit region, respectively, marked red a in digital image. c, g The edge Li deposition (marked red b) of ether-based and MIP-based electrolyte, respectively. d, h The cross section of Li deposition in ether−based and MIP-based, respectively. The Li deposition in ether-based electrolyte shows columnar structures and the thickness is ~20 μm; The Li deposition in MIP-based electrolyte shows the thickness (~10 μm) is only half of that in ether-based electrolyte, implying more dense lithium formation. the inset image in d, h shows growth model. i, j Optical microscope images of the Li deposits in ether (left column) and MIP (right column) -based electrolyte at 0, 10, 15, 20, 25, and 30 min at a current rate of 3 mA cm⁻². Scale bar, (a, c, e, g) 50 μm, (b, d, f, h) 10 μm. The scale bar in the inset, (a, e) 0.5 cm, (c, g) 10 μm