Fig. 1: Fabrication and structure of HAN. | Nature Communications

Fig. 1: Fabrication and structure of HAN.

From: Nanoelectrode design from microminiaturized honeycomb monolith with ultrathin and stiff nanoscaffold for high-energy micro-supercapacitors

Fig. 1

a Illustration of the HAN fabrication process. b SEM image of nanoporous alumina after anodization process revealing the double-layer cell structure. c SEM image of HAN with hexagonal cell arrangement and 400 nm inter-cell spacing showing the structure of HAN with ultrathin wall of 16 ± 2 nm. d Schematic of the evolution of the HAN by the second etching process. e Cross-sectional view SEM image of an HAN indicating the cell depth to be about 25 μm. f SEM image of HAN with hexagonal cell arrangement and 800 nm inter-cell spacing. The wall thickness of the cell is 18 ± 2 nm. g SEM image of HAN with square cell arrangement and 400 nm inter-cell spacing. The wall thickness of the cell is 12 ± 2 nm. h Large-scale SEM image showing the uniform, stable and defect-free structure of the HAN with hexagonal cell arrangement and 400 nm inter-cell spacing. Scale bar: 500 nm (b); 500 nm (c); 5 μm (e); 1 μm (f); 500 nm (g); 10 μm (h).

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