Fig. 3: Post-print bonding of SilDNs.
a Overview of 90° Pee Test and proposed schematic of bonding process. Numerous condensable groups (X = –OH, –OR, –NHR, –NHR[C=O]R, –O[C=O]CH3) can participate in the proposed interfacial bonding reaction. b Bond strength vs. wait time for 82%MM10T bonded to itself. Open symbols denote adhesive failure, closed symbols denote cohesive failure. The height of the error bars corresponds to the SD and the width of error bars denotes uncertainty in wait time (N > 7). c Bond strength for 82%MM10T to numerous substrates (N > 7 for each material combination). Materials* whose ultimate strength is below that of the SilDN display a lower bond strength as a result of cohesive failure through the substrate itself. Superscripts denote any modifications to the substrate that improved bondability. Triangle symbols represent ink-jetted samples, diamonds represent FDM printed samples, squares represent SLA printed samples, and circles represent conventionally fabricated (molding, rolling, or other) samples.
