Fig. 2: Material characterization.
From: A high-conductivity n-type polymeric ink for printed electronics
a–c 2D GIWAXS patterns of BBL (a), PEIlin (b), and BBL:PEIlin (50 wt% PEI, c) films. d, e Out-of-plane (d) and in-plane (e) GIWAXS line cuts of BBL, PEIlin, and BBL:PEIlin films. f N(1s) XPS analysis of BBL, PEIlin, and BBL:PEIlin (50 wt% PEI) films. g–j Atomic force microscope (AFM) images and corresponding conductive-AFM images of BBL (g height image; h current image) and BBL:PEIlin (i height image; j current image). The root mean square (RMS) surface roughness and average current are also reported.
