Fig. 10: Schematic of damage formation process during tensile strain.
From: Probing of the internal damage morphology in multilayered high-temperature superconducting wires
a Micro cracks in a cleavage-type started from the substrate. b Micro cracks propagate into the buffer layer with an increasing strain. c Microcracks penetrate into the superconducting layer along the directions of both the thickness and width when the strain further increases.
