Fig. 2: Measurement of a 10 µm etched Siemens star on silicon wafer.
From: Visualizing nanometric structures with sub-millimeter waves
a 3D Terahertz image of a Siemens star with a depth of 10.7 µm etched into a 520 µm thick silicon wafer. The vertical axis shows the optical thickness. b 3D image of the refractive index of the silicon Siemens star. c Extracted physical thickness of the silicon Siemens star for a cut along the line \(x=\) 8 mm indicated by the blue arrow in (a).
