Fig. 4: Contact structure and resistance.
From: A record thermoelectric efficiency in tellurium-free modules for low-grade waste heat recovery
Line scanning of resistance (R) across the Ni/Sb/CdSb and Ni/Fe/Mg3SbBi interfaces for estimating the contact resistance (a), SEM images, EDS mapping, and EDS line scanning for the Ni/Sb/CdSb (b) and the Ni/Fe/Mg3SbBi junctions (c).
