Table 1 Comparison of state-of-the-art electrostatic adhesive devices
From: A supramolecular gel-elastomer system for soft iontronic adhesives
| Â | Materials & fabrication | Performance | ||||
|---|---|---|---|---|---|---|
Application | Electrode | Contact layer | Patterning method | Operating voltage (kV) | Normal pressure (kPa), substrate | Shear pressure (kPa), substrate |
Aerial perching7 | Cu | PI | Sputtering with mask | 1.0 | 0.20, glass 0.21, steel | NA |
Wall climbing4 | Cu | PI | Sputtering with mask | 5.0 | 0.35, glass 0.51, paper | 1.05, glass 3.43, paper |
Wall climbing6 | Carbon grease | Silicone | NA | 4.0 | NA | 4.1, glass 2.4, paper |
Wafer handling8 | Cu | PI | Sputtering with mask | 2.0 | 1.5, glass 1.6, Al | NA |
Gripper12 | Au | PI | Evaporation with mask | 3.0 | 0.7, Ge-coated PI | 5.0, Ge-coated PI |
Gripper10 | Cu | Silicone | Chemical etching | 5.0 | 4.8, acrylic elastomer | 5.6, acrylic elastomer |
Gripper9 | Carbon composite | Silicone | Stamp printing | 5.0 | 13, PMMA* | 35, PMMA* |
Gripper11 | Carbon composite | Clarifoil film | Laser cutting | 4.8 | NA | 0.64, PMMA |
Gripper (this work) | Ionic OHGel | SHPU | Inkjet printing | 1.0 | 1.3, glass 2.1, Al | 2.4, glass 4.7, Al |
