Fig. 1: Schematic of the soldering and thermoforming process.
From: Tough soldering for stretchable electronics by small-molecule modulated interfacial assemblies
a Schematic illustration of the LM-based composite design and its integration with TPU substrate and electronic component. b Schematic illustration of the hierarchical assembly within the composite. c Molecular interactions between the polymer, LMP, and UPyMC modulators. d Molecular structure of the synthesized polymer. e Schematic illustration of the soldering and thermoforming processes. f Optical image of a 3D electronic enabled by the ULPC. Inset: The LED remains lit even under the action of external force lifting the entire electronics (50 g).
