Fig. 3: High-performance electronics enabled by robust and well-defined conductive metal patterns. | Nature Communications

Fig. 3: High-performance electronics enabled by robust and well-defined conductive metal patterns.

From: Well-defined in-textile photolithography towards permeable textile electronics

Fig. 3

a Tensile property of the commercial polyester fabric and polyester fabric after in-textile photolithography. b Resistance of the Cu patterns with different linewidths in polyester fabric during the 10,000-cycle bending test (bending radius: 4.4 mm). c Resistance changes of the Cu patterns with and without additional Au deposition upon 20 washing cycles. Error bars represent the s.d. of the mean from five Cu patterns. d Resistance of the interconnects during 180 times crumpling test. e Resistance upon 20 washing cycles (encapsulated with Ecoflex and measured by connecting the interconnects to 0 Ω resistors). f Cyclic voltammetry curves of the micro-supercapacitors made with interdigital Ni electrodes with different linewidths. MnO2 is the electrochemically active material. g Areal capacitance of the micro-supercapacitors with different linewidths. Insets are digital images showing the electrode arrays of the micro-supercapacitors with different linewidths. h Digital images of the double-sided wearable temperature monitoring patch with in-situ alarming function based on well-defined and double-sided Cu pattern in polyester fabric.

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