Fig. 3: Thermal properties of BNNS-TIMs. | Nature Communications

Fig. 3: Thermal properties of BNNS-TIMs.

From: Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge

Fig. 3

A Summary of the through-film thermal conductivity of h-BN based TIMs using different processing methods15,16,28,29,30,61,62,63,64,65,66,67,68,69,70,71. B The total thermal resistance of specimens with 50–90 wt% filler loadings, 1 mm thickness, under a pressure of 50 or 100 psi, with a configuration illustrating the measurement method. At such pressure, the fabricated TIMs can effectively maintain shape fidelity (Fig. S2). C Comparison of the effective through-film thermal conductivity under different packaging pressures with commercial products and other reports72,73,74,75,76. D A radar chart showing the advantages of our BNNS-TIMs compared to other reports and commercial products in various properties72,73.

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