Fig. 4: Experimental and simulation proof of the efficacy of interfacial phonon bridge strategy.
A Thermal resistance of specimens with a thickness of 1 mm at filler loadings of 50–90 wt% under a pressure of 50 psi. The red and pink curves, respectively, represent the thermal contact resistance between TIMs and copper plates (Ri) and the material’s thermal resistance (Rm). The blue curve describes the hardness (Shore A) of the TIMs. B Thermal contact resistance of specimens with thicknesses in the range 0.2–1.7 mm with loadings of 70 and 90 wt.%. C–F NEMD simulation that shows the mechanism of how the filler contact angle α influences the interfacial thermal conductance. The contact angle was set as 30°, 45°, 60° or 90°. C Illustration of the simulation box, where the hot bath and cold with copper plates attached are placed on the top and bottom of the box, and BNNSs interconnect with each other at the contact angle of α. D PDOS spectra at different contact angles and the edges of contact BNNSs are the focus of the calculation. E Degree of overlap of the PDOS spectra and the corresponding interfacial thermal conductance at the contact interface between two layers of BNNS. F Phonon transmission function spectrum.
