Fig. 1: Design of microstructured pressure sensors with a bonded interface via topological interlinks. | Nature Communications

Fig. 1: Design of microstructured pressure sensors with a bonded interface via topological interlinks.

From: Ultrafast piezocapacitive soft pressure sensors with over 10 kHz bandwidth via bonded microstructured interfaces

Fig. 1

a Schematic and SEM image of the conventional microstructured pressure sensor with a non-bonded interface. b Schematic and SEM image of our pressure sensor with a bonded interface. c Finite element simulations of both non-bonded and bonded pressure sensors under the loading process. d Comparison of normalized increased contact area ΔA/D in a loading-unloading cycle. e Comparison of normalized energy loss in a loading-unloading cycle. f Normalized change in capacitance as a function of pressure of the bonded pressure sensor. g The response-relaxation times of the sensor with a bonded interface and the sensor with a non-boned interface. h Comparison of our sensor and existing capacitive sensors in terms of response time and relaxation time. i Comparison of our sensor with existing capacitive sensors in terms of detectable pressure limit and corresponding frequency range.

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