Fig. 1: Integrated TED for in-chip transient thermal management.
From: Thermoelectric active cooling for transient hot spots in microprocessors
a An embedded TED under the localized hot spot generated by a high frequency circuit within a microprocessor. b Illustration of active cooling. In contrast to a conventional thermoelectric refrigerator, heat is removed from the hot side to the cold side through a combination of Peltier cooling and natural heat diffusion. Consequently, high κ materials are selected to facilitate more significant natural heat conduction. c Schematic of the 3D model of a TED with transient thermoelectric active cooling. The top metal coated surface is heated by a radially gaussian sinusoidal heat source. Sinusoidal AC current is driven vertically through the device with the same frequency as the heat source. d Illustration of model’s analytical result demonstrates the final hot spot’s first harmonic temperature profile. This profile results from the combination of passive cooling and thermoelectric cooling, with the thermoelectric cooling effect being influenced solely by the electrical current’s parameters and the operating frequency.
