Fig. 4: COPtrans and improvement of energy efficiency by sizing TED’s hot-side contact area.
From: Thermoelectric active cooling for transient hot spots in microprocessors
a Numerical COPtrans value at transient temperature cancellation point determined from the analytical solution. b Measured COPtrans vs frequency for various absorbed heat flux amplitudes. Both experimental and theoretical data demonstrate that an increase in the amplitude of the heat input, along with an increase in the operating frequency, results in a decrease in COPtrans. c Theoretical ratio of COPtrans between p-Si and p-Bi2Te3 devices as a function of frequency for q”RMS = 10 kW cm−2 and hot side metal electrode thicknesses of 0 nm, 10 nm and 50 nm. Reduced electrode thickness magnifies the contrast of passive cooling effects between these two materials thereby increase the ratio. d T1ω’s change when unit AC current applied measured on TED with different hot-side contact areas. For smaller contacts, the application of a unit AC current leads to a more significant reduction in T1ω. Consequently, sizing the hot-side contact to match the heat source can improve TED’s power efficiency in transient active cooling.
