Table 1 Performance metric for TEM with Cricket

From: Fast imaging of millimeter-scale areas with beam deflection transmission electron microscopy

imaging parameters

avg. 3 nm/pix (120 ms exp.)

avg. 3 nm/pix (40 ms exp.)

peak 3 nm/pix (40 ms exp.)

avg. 3.6 nm/pix (40 ms exp.)

unit

x,y pixel size*

3

3

3

3.6

nm/pixel

tile size (per size)

6000

6000

6000

6000

pix

FOV size

18

18

18

21.6

μm

pixels per tile

36

36

36

36

Mpixel

supertile size (per side, 15% overlap b/w tiles)

16200

16200

16200

16200

pix

overlap between supertiles

600

600

600

600

pix

exposure time (exp.)

120

40

40

40

ms

tiles per section (w/overlap)

4356

4356

4140

2916

tile

supertiles per section (w/overlap)

484

484

460

324

supertile

imaging time per section

11.7

6.6

4.7

4

minute

transition overhead (tape translation, ROI definition, autofocus, etc.)

2.2

2.2

1.8

2.2

minute

total time per section

13.9

8.8

6.5

6.2

minute

burst imaging rate (imaging only)

300

900

900

900

Mpix/s

montage imaging rate (w/ stage, Cricket)

223

397

529

437

Mpix/s

net imaging rate (w/ stage, Cricket, transition)

188

297

382

282

Mpix/s

effective imaging rate (w/ stage, Cricket, transition, overlap)

142

224

288

213

Mpix/s

sections per day (1 scope at 24 h)

103

163

221

232

section

time to image 1 mm³ (4 scopes at 24/7)

54

35

26

24

days

time to image 1 mm³ (4 scopes at 65% uptime #)

83

53

39

37

days

  1. Based on 1 mm² section of 45 nm thick.
  2. # 65% uptime accounts for microscope maintenance, imaging pause (Yin et al. 2020).
  3. *Pixel size is different from resolution, which refers to the capability of an imaging system to perceive two point sources separately.
  4. Typical TEM section thickness is 45 nm in z, while FIB-SEM offers a z resolution of 4 nm (Xu et al. 2017).