Fig. 5: Thermal transport properties, and zT of P- and N-type films. | Nature Communications

Fig. 5: Thermal transport properties, and zT of P- and N-type films.

From: Oriented Bi2Te3-based films enabled high performance planar thermoelectric cooling device for hot spot elimination

Fig. 5

a Temperature dependent total thermal conductivity and (b) lattice thermal conductivity versus Te content for P-type Bi0.4Sb1.6Te3+x and N-type Bi2Te3+x films; (c) Room-temperature spectral lattice thermal conductivity (κs) calculated using the Debye–Callaway model. G represents grain boundary scattering, U refers to the Umklapp process, PD refers to the point defect scattering, and D refers to the dislocation scattering, and S refers to the stacking faults scattering. d thermoelectric figure of merit for P-type Bi0.4Sb1.6Te3+x and N-type Bi2Te3+x films in this work.

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