Fig. 6: Cooling Performance of obtained planar film thermoelectric devices. | Nature Communications

Fig. 6: Cooling Performance of obtained planar film thermoelectric devices.

From: Oriented Bi2Te3-based films enabled high performance planar thermoelectric cooling device for hot spot elimination

Fig. 6

The optimized geometric dimensions and f-TEC prepared in this work (a); the cooling ability in air captured by inferred camera at 300 K (b); the current dependent cooling temperature of simulation and experiment result at different hot end temperatures (c); the maximum cooling temperature at different hot end temperatures, together with the reported planar7,10,43,44,45,46,47,48,49, superlattice vertical5,50 and other vertical f-TECs for comparison2,3,5,50,51,52,53 (d).

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