Fig. 3: Thermoelectric characterization of Ag- or Cu-Containing Bi-Sb-Te Films.
From: Cu- or Ag-containing Bi-Sb-Te for in-line roll-to-roll patterned thin-film thermoelectrics
a–e Effect of metal feed-rate on (a) S – Seebeck coefficient; (b) ρ - Electrical resistivity (Data of S and ρ are presented as mean ± standard deviation based on nine measurements); (c) PF - Power factor; (d) n – Carrier concentration; (e) μ - Carrier mobility (Data of n and μ are presented as mean ± standard deviation based on measurements from three identical samples). f Comparison of Cu- or Ag-containing Bi-Sb-Te materials: ‘Cu/Bulk’ refers to a Cu-containing Bi-Sb-Te bulk sample, while ‘Ag/Film’ or ‘Cu/Film’ refers to Ag- or Cu-containing Bi-Sb-Te thin-film samples (see references in Table S3, Supplementary Information). g Seebeck coefficient vs (carrier concentration)-2/3. h Seebeck coefficient vs (carrier mobility)0.2 (the lines indicate the linear fits for both the n-type and p-type regions). i Electrical resistivity vs (carrier concentration*mobility)-1 (the lines indicate the linear fits for both the Ag and Cu groups).
