Fig. 3: Characterizations of thin-film-based thermoelectric devices. | Nature Communications

Fig. 3: Characterizations of thin-film-based thermoelectric devices.

From: Enabling ultra-flexible inorganic thin-film-based thermoelectric devices by introducing nanoscale titanium layers

Fig. 3

a Illustration of the structure of the thin-film-based thermoelectric device. From the substrate to the thermoelectric legs, the components are PI (flexible substrate), Ti contact layer (Ti-2), Cu (electrode), Ti barrier layer (Ti-1), and thermoelectric thin films (BTS or BST). b XRD results of PI/Ti-2/Cu/Ti-1/BTS (top) and PI/Ti-2/Cu/Ti-1/BST (bottom). c, d SEM images of PI/Ti-2/Cu/Ti-1/BST and PI/Ti-2/Cu/Ti-1/BTS from cross-sectional views. e, f Corresponding EDS line scan results. g, h SEM images of PI/Cu/BST and PI/Cu/BTS from cross-sectional views (without Ti layers).

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