Fig. 3: Decoupling mechanism of mechanical and thermal stimuli in TESF. | Nature Communications

Fig. 3: Decoupling mechanism of mechanical and thermal stimuli in TESF.

From: Three-dimensional flexible thermoelectric fabrics for smart wearables

Fig. 3

I-V curves of TESF (a) without external stimuli, (b) under compressive strain alone, (c) under both compressive strain and ΔT, (d) under ΔT only, (e) at different ΔT values (ΔT = 0, 1, and 3 K), (f) under various compressive strains (0%, 30%, 60%), and (g) under different strains (0%, 30%, 60%) with a constant ΔT of 1 K. h Finite element simulation of temperature distribution and output thermal voltage of TESF under compressive strain.

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