Fig. 3: Electrical resistivity, thermal stability, and magnetic properties of the MOS. | Nature Communications

Fig. 3: Electrical resistivity, thermal stability, and magnetic properties of the MOS.

From: Unlocking property constraints through a multi-level ordered structure strategy

Fig. 3

a The electrical resistivity (ρ) of the MOS-S compared to its constituents α-Fe and Nd2Fe14B. Error bars represent the range of ρ. b Comparison of the ρ of the MOS-S, homo-structure (HS) with the same composition, gradient structures (GS) Nd2Fe14B, GS Nd2Fe14B/α-Fe (both without the sandwich core-shell structure), single crystal (S.C.) NdFeB, commercial (Comm.) SmCo5, Sm2Co17 and NdFeB. Error bars represent the range of ρ. c Comparison of the thermal stability of Hc among the MOS, commercial NdFeB, untreated NdFeB, and NdFeB treated by grain boundary diffusion process (GBDP) and alloying. The thermal stability of Hc is designated as 1/|β|, where β is the temperature coefficient of Hc. d Comparison of the ρ and 1/|β| of the MOS and the state-of-the-art commercial performances, including SmCo5, Sm2Co17 and NdFeB. Error bars represent the range of ρ and 1/|β|. e Plot of Br and Hc of the MOS, GS Nd2Fe14B, GS Nd2Fe14B/α-Fe and NdFeB based nanocomposite magnets prepared by various methods, including melt spinning (MS), high-pressure torsion deformation (HPTD) and amorphous alloys annealing (ANN). f The changes in (BH)max and ρ in the MOS fabricated using the FASA method compared to NdFeB magnets prepared by GBDP and NdFeB composite magnets with Dy2O3, NdF3, CaF2 and SiO2. The data for comparison are derived from literature, see Supplementary Tables 37.

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