Fig. 3: HAF-LIOF capability of TFTEC dies to cool large-area with minimal number of P-N couples.
From: Nano-engineered thin-film thermoelectric materials enable practical solid-state refrigeration
The implementation of HAF-LIOF allows high heat flux through the active thin-film thermoelectric P-N couple while achieving low input heat flux from the refrigeration compartment and similarly low output heat flux rejected to the heat-sink. This implementation is shown as a function of current (0.5 A, 1.0 A, 3.0 A and 4.0 A) at the die-level of the module (a–e) and with a common heat-spreader (f–j). This approach also allows for the minimization of TE materials usage and simpler heat-source and heat-sink requirements, needed for cost-effective solid-state refrigeration.
