Table 1 Binary gas mixtures of C3F8 and c-C4F8 with application scenarios in semiconductor etching processes
Gas mixtures | Application scenarios | Substrate materials |
|---|---|---|
c-C4F8/N2 | Low-k material etching with reduced damage | SiO2, porous SiCOH |
c-C4F8/Ar | High-aspect-ratio dielectric etching | SiO2, low-k dielectrics |
c-C4F8/O2 | Selective etching of Si3N4 | Si3N4 |
C3F8/H2 | Selective tungsten (W) etching | W, Si, SiO2 |
C3F8/O2 | Bulk etching of poly-Si or metal layers | Poly-Si, Aluminum |
C3F8/Ar | Shallow etching of SiO2 | SiO2 |
