Fig. 1: Illustrations of SOI-based nano-kirigami.
From: Silicon nano-kirigami with controlled plastic, elastic and hysteretic deformations
a Flowchart of the nano-kirigami process on an SOI chip. 2D precursors are patterned by FIB or EBL followed by a wet etching process, which can be deformed upward or downward upon request. b Plastic deformation exhibiting permanent bidirectional deformations under FIB irradiation. c Elastic deformation exhibiting instantaneous recovery under mechanical or electrostatic forces. The vertical axis in the inset is displayed in arbitrary units (a.u.). d Hysteretic deformation exhibiting time-dependent recovery under variable electrostatic forces due to charge accumulation and relaxation. Scale bars: 1 µm.
