Fig. 3: Microstructure of 16 vol% DMGr/Cu-60 h before (a–f) and after micropillar compression (g–j).
From: High strength and plasticity in disordered multilayer graphene reinforced copper composites

a Bright field scanning transmission electron microscopy (BF-STEM) image. The inset shows the selected-area electron diffraction (SAED) pattern. b High-resolution transmission electron microscopy (HRTEM) image showing DMGr along grain boundaries (GBs) taken with \([1\bar{1}0]\) zone axis, the inset is Fast Fourier transform (FFT) pattern. c–f Enlargement of HRTEM images in (b) marked by (c–f), respectively. g–i HRTEM images showing high density of dislocations, nano-twins, and multiple stacking faults (MSFs) in NC grains. j HRTEM image showing the intersected SFs. The insets in (h–j) are the corresponding FFT patterns.