Fig. 1: Facile and cost-effective fabrication of soft, stretchable, transient electronics at wafer-scale.
From: Solution-processable and photo-curable system for low-cost and scalable transient electronics
a Photograph of an ultrathin, soft, and stretchable transient electronic world map conformally wrapped on a globe, which was fabricated through multiple depositions of solution-processable, photo-patternable electronic materials including insulators, conductors and semiconductors (left), chemical structures of constituting components for the electronics materials (top right), and schematic illustration of a thin-film transistor (TFT) array (bottom right). The electronic world map was colorized for ease of viewing. UV-PLCL, ultraviolet (UV)-curable and biodegradable elastomer, poly(l-lactide-co-ε-caprolactone); TPO, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; TTMP, trimethylolpropane tris(3-mercaptopropionate); PEDOT:PSS, poly(3,4-ethylenedioxythiophene) polystyrene sulfonate; HDD, 2,4-hexadiyne-1,6-diol; P3HT, poly(3-hexylthiophene). b Optical images of a wafer-scale, ultrathin elastomeric transient electronics array (left) and a magnified view of a unit device featuring a microheater, capacitor, pressure sensor array, TFT array, and inductive coil (right). (c,d) Photographs of the transient electronics under mechanical strain (c) and in conformal contact with the wrinkled surface of a brain phantom (d). e Time-sequential images showing the gradual dissolution of the transient elastomeric electronics under accelerated conditions (phosphate-buffered saline, PBS, pH 13) at body temperature (37 °C).
