Fig. 2
Stress–strain relations and average flow stress from molecular dynamics simulations of nanotwinned polycrystalline Cu samples. a Simulated stress–strain curves of nanotwinned Cu samples with a grain size of 10 nm and different twin thicknesses at two temperatures T = 1 and 300 K. b Average flow stress calculated for the strains in the range of 6–10% as a function of the twin thickness for the simulated nanotwinned Cu samples. Continuous hardening by decreasing the twin thickness is observed at 1 K, while at 300 K, the flow stress first increases and then decreases below a critical twin thickness. Error bars represent the standard deviation from statistical analyses
