Fig. 8 | npj Flexible Electronics

Fig. 8

From: Transfer printing techniques for flexible and stretchable inorganic electronics

Fig. 8

Aphid-inspired transfer printing techniques: surface-relief assisted transfer printing. a Surface-relief assisted transfer printing technique. (1) Implementation of the aphid-inspired, surface-relief assisted transfer printing for deterministic assembly; SEM images of the (2) collapsed stamp and (3) recovered stamp with silicon platelets (3 μm thick; 100 × 100 μm) on their surfaces; (4) Force required to remove a microtip surface from the silicon, as a function of retraction speed for three different preload cases, simulating the steps of retrieval (1.5, 3 mN) and printing (0.2 mN) process. Adapted with permission from ref. 71 b Schematic illustration of the bonding/debonding between the SMP stamp surface and a substrate, where the recovery of the micro-pyramid structures is controlled by global heating. Reprinted with permissions from ref. 93 c Schematic illustration of the programmable printing process via automated laser writing on a micropatterned shape memory polymer stamp. Reprinted with permissions from ref. 52 d Devices and structures fabricated by surface-relief assisted transfer printing. (1) Carbon nanotube field effect transistor (CNFET) with 100 nm thick air gap dielectric fabricated using surface-relief assisted transfer printing a heavily doped silicon platelet. Reprinted with permissions from ref. 71 (2) Bendable and twistable imbricate architecture design sample realized by surface-relief assisted transfer printing. Reprinted with permissions from ref. 95 (3) Series-connected array of pressure activated connections on flexed PEN fabricated using surface-assisted transfer printing. Reprinted with permissions from ref. 96 (4) “MECHSE” pattern of gold-coated Si inks on a curved PDMS substrate using multiple selective printing steps with laser-driven, surface-relief assisted SMP stamp. Reprinted with permissions from ref. 51

Back to article page