Table 1 Summary and comparison of the performances of typical transfer printing techniques

From: Transfer printing techniques for flexible and stretchable inorganic electronics

TP method

Material

Stamp geometry

Adhesion control

Max adhesion

Switchability

Retrieval mode

Printing mode

Reusability

Temperature

Ref.

(kPa)

(max/min)

(°C)

Chemistry/Glue

PDMS

Flat/Post

Surface chemistry/Glue

Very higha

/

S/NS

NS-C

NR

AT-150

32, 45, 56,57,58,59,60,61,62,– 63

Solvent releasable tape

Tape

Flat

Solution

Very higha

Inf

NS

NS-C

NR

AT-100

13, 65, 66

Thermal releasable tape

Tape

Flat

Temperature

Very higha

Inf

NS

NS-C

NR

~100

10, 67

Kinetically controlled

PDMS

Flat/Post

Peeling velocity

/

/

S/NS

NS-C

R

AT

48

Kinetically controlled

PDMS

Post

Peeling velocity

150

<3:1

S

NS-C

R

AT

71

Kinetically controlled

PDMS

Pedestal

Peeling velocity

1600

2:1

S

NS-C

R

AT

83

Laser-driven non-contact

PDMS

Post

Laser heating

/

Inf

S

S-NC

R

~275

72, 73

PDMS

Pedestal

Laser heating

1600

Inf

S

S-NC

R

~275

83

Angled microflap stamp

PDMS

Angled microflap

Retraction angle

10

>13

NS

NS-C

R

AT

81

Shear-enhanced

PDMS

Post

Shear motion

85

>10:1

S

NS-C

R

AT

55

Shear-enhanced

PDMS

Angled post

Shear motion

100

100:1

S- R2R

NS-C- R2R

R

AT

86

Shear-enhanced

ST-1087

Cylinder pillar

Shear motion

1450

39:1

S

NS-C

R

AT

82

Buckling actuated

ST-1087

Cylinder pillar

Compression buckling

1081

35:1

S

NS-C

R

AT

82

Gecko seta stamp

Gecko seta array

Hierarchy

Shear motion

202.5

Inf

NS

NS-C

R

AT

84

Inflatable stamp

PDMS

Post

Inflation (contact area change)

50

50:1

S

NS&S-C

R

AT

91

Surface-relief-assisted

PDMS

Post with pyramid relief

Compression (contact area change)

80

>1000:1

S

NS-C

R

AT

71

Surface-relief-assisted

SMP

Pyramid relief

Heating (contact area change)

2800

>1000:1

NS

NS-C

R

40–60

93

Surface-relief-assisted

SMP

Pyramid relief

Laser heating (rigidity and contact area change)

/

/

NS

NS&S-C

R

~40

51

Surface-relief-assisted

SMP

Pyramid relief

Laser heating (rigidity and contact area change)

/

/

NS

S-C

R

~40

52

  1. S selective mode, NS non-selective mode, C contact mode, NC non-contact mode, AT atmosphere temperature, R2R roll-to-roll mode, R reusable, NR not reusable, Inf infinity, / not available
  2. aThe maximum adhesion of the stamp/ink interface assisted with surface chemistry and glues is so strong that it can easily lead to stamp failure instead of interfacial failure.56 The adhesion strength of the tape/ink interface is usually several orders stronger than that of the elastomer stamp/ink interface.10