Table 1 Summary and comparison of the performances of typical transfer printing techniques
From: Transfer printing techniques for flexible and stretchable inorganic electronics
TP method | Material | Stamp geometry | Adhesion control | Max adhesion | Switchability | Retrieval mode | Printing mode | Reusability | Temperature | Ref. |
---|---|---|---|---|---|---|---|---|---|---|
(kPa) | (max/min) | (°C) | ||||||||
Chemistry/Glue | PDMS | Flat/Post | Surface chemistry/Glue | Very higha | / | S/NS | NS-C | NR | AT-150 | |
Solvent releasable tape | Tape | Flat | Solution | Very higha | Inf | NS | NS-C | NR | AT-100 | |
Thermal releasable tape | Tape | Flat | Temperature | Very higha | Inf | NS | NS-C | NR | ~100 | |
Kinetically controlled | PDMS | Flat/Post | Peeling velocity | / | / | S/NS | NS-C | R | AT | |
Kinetically controlled | PDMS | Post | Peeling velocity | 150 | <3:1 | S | NS-C | R | AT | |
Kinetically controlled | PDMS | Pedestal | Peeling velocity | 1600 | 2:1 | S | NS-C | R | AT | |
Laser-driven non-contact | PDMS | Post | Laser heating | / | Inf | S | S-NC | R | ~275 | |
PDMS | Pedestal | Laser heating | 1600 | Inf | S | S-NC | R | ~275 | ||
Angled microflap stamp | PDMS | Angled microflap | Retraction angle | 10 | >13 | NS | NS-C | R | AT | |
Shear-enhanced | PDMS | Post | Shear motion | 85 | >10:1 | S | NS-C | R | AT | |
Shear-enhanced | PDMS | Angled post | Shear motion | 100 | 100:1 | S- R2R | NS-C- R2R | R | AT | |
Shear-enhanced | ST-1087 | Cylinder pillar | Shear motion | 1450 | 39:1 | S | NS-C | R | AT | |
Buckling actuated | ST-1087 | Cylinder pillar | Compression buckling | 1081 | 35:1 | S | NS-C | R | AT | |
Gecko seta stamp | Gecko seta array | Hierarchy | Shear motion | 202.5 | Inf | NS | NS-C | R | AT | |
Inflatable stamp | PDMS | Post | Inflation (contact area change) | 50 | 50:1 | S | NS&S-C | R | AT | |
Surface-relief-assisted | PDMS | Post with pyramid relief | Compression (contact area change) | 80 | >1000:1 | S | NS-C | R | AT | |
Surface-relief-assisted | SMP | Pyramid relief | Heating (contact area change) | 2800 | >1000:1 | NS | NS-C | R | 40–60 | |
Surface-relief-assisted | SMP | Pyramid relief | Laser heating (rigidity and contact area change) | / | / | NS | NS&S-C | R | ~40 | |
Surface-relief-assisted | SMP | Pyramid relief | Laser heating (rigidity and contact area change) | / | / | NS | S-C | R | ~40 |