Fig. 1: Heat leakage through the flexible filler and its impact on the temperature differential across the thermoelectric legs.
a Cross-sectional microscope image of a flexible TEG with liquid metal interconnects. b A simple three-resistor thermal equivalent circuit of a TEG. c Cross-sections parallel and orthogonal to the interconnects illustrating simulated heat flow lines through the thermoelectric legs and the surrounding elastomer with three different thermal conductivities of (i) 0.15, (ii) 0.08, and (iii) 0.025 Wm−1 K−1. d Simulated temperature differential plotted as a function of module fill factor and elastomer thermal conductivity.
