Fig. 2: Mechanical tunability of the 3D seesaw-like mesostructure.
From: Tunable seesaw-like 3D capacitive sensor for force and acceleration sensing
a Schematic illustration of geometric parameters of the precursor pattern used to assemble the 3D seesaw-like mesostructure, including thickness t; supporting ribbon width Ws, and length Ls; mover width Wm and length Lm; and the length Lb of bonding sites. b Profile of the 3D seesaw-like mesostructure (along with the green line) under different applied strains (εappl = 0.8%, 2.0%, 2.5%, 2.9%, and 3.2%). The inset shows the profile of the 3D mesostructure. c Normalized average height (Zave/L) of four points (point 1~4, shown in (a)) as a function of applied strains (εappl). d Scaling laws, FEA results, and measurements for the equivalent stiffness (F/U) as a function of applied strain (εappl). e Out-of-plane compressive force as a function of Z-direction displacement (U) under different applied strain (εappl = 0.8%, 2.0%, 2.5%, 2.9%, and 3.2%). The right panel shows the Z coordinate under the applied strain (εappl = 0.8%). f Contour plot of the equivalent stiffness (F/U) of the 3D seesaw-like mesostructure in terms of Ls and tCu for Ws = 350 μm and εappl = 1.2%. g Contour plot of the equivalent stiffness (F/U) of the 3D seesaw-like mesostructure in terms of Ls and Ws for tCu = 25 μm and εappl = 1.2%. h Contour plot of the equivalent stiffness (F/U) of the 3D seesaw-like mesostructure in terms of tCu and Ws for Ls = 1.5 mm and εappl = 1.2%.
